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TDSTY-CNT10CU75CP50M500
- Categories:Carbon Nanotube Copper/Aluminum Platinum Heat Dissipation Applications
- Time of issue:2020-06-17 00:00:00
- Views:0

SUBSTRATE |
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1 |
ARTICLE NAME |
Thickness(mm) |
Specification name |
Test Method |
reference standard |
Carbon nanotubesCNT |
0.01mm ±0.003mm |
Monofilament thermal conductivity |
TEM/TC |
JY/T011-1996 |
|
Volume resistance﹤500mΩ.cm |
Micro-resistance meter |
JY/120-1997 |
|||
2 |
Copper-Platinum Electrolysis |
0.075mm ±0.005mm |
Basal weight(g/m2) |
national standard |
GB/T5230-1995 |
Mass resistivity |
national standard |
GB/T5230-1995 |
|||
3 |
thermally conductive adhesive |
0.05mm ±0.01mm |
Basal weight(g/m2) |
/ |
ASTM D3330 |
4 |
Monosilicone release paper |
0.075mm ±0.01mm |
Peeling rate 25g/25mm |
/ |
/ |
PRODUCTION THCKNESS |
0.140mm±0.005mm |
COLOR |
Black on one side |
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SMOOTHNESS |
GOOD |

trademark |
appearance |
Solid content(%) |
Viscosity (Tu-4) |
stiffness |
water resistance |
Square resistors |
DH120 |
black |
20±1 |
22-26S |
HB |
Immersion 24H |
10^3-10^4 |

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