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TY-CNT06CU10Ca05M500
- Categories:Carbon Nanotube Copper/Aluminum Platinum Heat Dissipation Applications
- Time of issue:2020-06-17 00:00:00
- Views:0

Base Material SUBSTRATE |
|||||
1 |
Name of material |
Thickness (mm) |
Specification name |
Test methods |
Reference standards |
|
Carbon nanotubes |
0.006mm ±0.002mm |
Monofilament Thermal Conductivity |
TEM/TC |
JY/T011-1996 |
|
|
|
Volume resistance <300Ω.cm |
Microresistors |
JY/120-1997 |
2 |
Copper-Platinum Electrolysis |
0.01mm ±0.002mm |
Basis weight (g/m2) |
National standard |
GB/T5230-1995 |
|
|
|
Mass resistivity |
National standard |
GB/T5230-1995 |
3 |
Thermally Conductive Tape |
0.005mm ±0.002mm |
Basis weight (g/m2) |
/ |
ASTM D3330 |
4 |
Mono Silicon Release Film |
0.05mm ±0.005mm |
Peel rate 25g/25mm |
/ |
/ |
Total thickness of product(mm) |
0.023mm±0.006mm |
COLOR |
Black on one side |
||
|
|
SmoothnessSMOOTHNESS |
GOOD |

Brand number |
Appearance |
Solid content (%) |
Viscosity (Tu-4) |
Hardness |
Water resistant |
Square resistors |
DH120 |
Black |
20±1 |
22-26S |
HB |
Soaked for 24H |
10^3-10^4 |

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